Metallographic Analysis of Deformation Failure of Tungsten Ring for MOCVD
Author of the article:DU Xiaoping;HE Wei;LI Zhengjia;MA Hongzheng
Author's Workplace：Xi`an Hantang Analysis&Test Co.,Ltd.,Xi`an 710000,China
Key Words：tungsten middle ring secondary recrystallization metallographic simulate the temperature
Abstract：
To solve the problem of short life of domestic tungsten midring in MOCVD epitaxial equipment,metallographic detection and comparative analysis of imported and domestic tungsten midring were conducted.Using analysis software,the temperature change of tungsten middle ring was simulated.The results show that the microstructure changed from long fiber to equiaxial crystal after the failure of tungsten ring,and some of the microstructure underwent secondary recrystallization.The grain size varies at different positions in the tungsten midring,which is the main reason for the uneven deformation of the tungsten midring.The original structure of domestic tungsten midring is a long fiber structure in rolling state.The recrystallization of imported tungsten middle ring original structure can effectively reduce and delay the occurrence of secondary recrystallization and improve the service life of tungsten midring.
