Effect of Duty Factor on Microstructure and Properties of AlN Coating Ion-plated on Copper/diamond Composite
Author of the article:WANG Amin;DAI Jingjie;OU Yonghui;HU Xiangxiang
Author's Workplace：Key Laboratory of New Metal Functional Materials and Advanced Surface Engineering in Universities of Shandong,Qingdao Binhai University,Qingdao 266555,China
Key Words：copper/diamond composite aluminum nitride multi-arc ion plating duty factor electrical insulation
Abstract：
The AlN coating was prepared on the surface of Cu/diamond composite by multi-arc ion plating technology to improve the surface electrical insulation performance.the effect of duty factor on the microstructure and properties of AlN coating was discussed.The results show that the AlN coating grow preferentially on(220)crystal face and in orientation on(002)and(101)crystal face.With the increase of duty factor(20%,40%,60%),the surface particles of AlN coating tend to be uniformly fine and densified,and the bright white particles decrease significantly,but the duty factor is too high,and the large particles and bright white particles increase significantly.The thermal conductivity of Cu/diamond composite decrease slightly after AlN coating,but the surface electrical insulation is improved greatly.When the duty factor is 40%,the AlN coating is compact and uniform,and the electrical insulation is optimal.
