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结晶器固态渣膜形成过程及传热研究
Forming Process and Heat Transfer of the Solid Mold Flux Film
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- DOI:
- 作者:
- 王艺慈,张芳,董方
- 作者单位:
- 内蒙古科技大学材料与冶金学院,内蒙古 包头 014010
- 关键词:
- 结晶器;固态渣膜;形成过程;热流密度
Crystalline apparatus; Solid mold flux film; Forming process; Heat flux density
- 摘要:
- 通过自制的模拟铜结晶器实验装置,模拟结晶器固态渣膜的形成过程,研究无氟渣膜形成过程中渣膜状态及热流密度的变化,并利用扫描电镜、X射线衍射仪研究了渣膜的微观结构及结晶矿物。结果表明,随着模拟铜结晶器实验装置浸入渣液时间的延长,结晶器壁渣膜呈逐渐增厚的趋势,晶体质渣膜的成长速度比玻璃质渣膜要快得多,且固态渣膜形成过程中结晶矿物种类不变;穿过固态渣膜的热流密度呈下降趋势,尤其在浸入渣液25 s内,热流密度的下降趋势更为显著;渣膜传热是固态渣膜中的气孔、结晶率和渣膜厚度三方面因素综合作用的结果。
An experimental apparatus for simulating copper mold was used to simulate the forming process of solid mold flux film, and the change of heat flux density and the state of mold flux film during the forming process of fluorinefree mold flux film were studied. The scanning electron microscope and Xray diffractometer were adopted to determine the microstructure and crystalline minerals of mold flux film. The research results show the thickness of solid mold flux film gradually increases in the process of growth of solid mold flux film, and the velocity of growth up of crystalline mold flux film is higher than that of glassy mold flux film. The kinds of crystalline minerals have no change during the formation of mold flux film. In addition, the heat flux density decreases obviously (especially in 25 s) after the experimental apparatus is immerged in the liquid slag, and the heat transfer of mold flux film is controlled by three factors including air holes in the solid mold flux film, crystallization index and the thickness of mold flux film at the same time.