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制备工艺对 STTO/PVDF 复合材料结构及性能的影响
Effect of the Preparation Process on the Structure andProperties of the STTO/PVDF Composites
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- DOI:
- 作者:
- 倪 磊 1，马莹莹 1，常 蓉 1，孟瑞希 1，林堉鑫 1，钟 宏 2
NI Lei1, MA Yingying1, CHANG Rong1, MENG Ruixi1, LIN Yuxin1, ZHONG Hong2
- 作者单位:
- 1. 长安大学 材料科学与工程学院，陕西 西安 710018；2. 西北工业大学 凝固技术全国重点实验室，陕西 西安 710072
1. School of Materials Science and Engineering，Chang'an University, Xi'an 710018, China; 2. State Key Laboratory ofSolidification Processing, Northwestern Polytechnical University, Xi'an 710072, China
- 关键词:
- STTO/PVDF 复合材料；热压法；流延法
STTO/PVDF composite materials; hot pressing method; casting method
- 摘要:
- 为满足微电子领域对高性能柔性介电材料的需求，以(Sm0.5Ta0.5)0.04Ti0.96O2 (STTO)巨介电常数陶瓷为填料，聚偏氟乙烯(PVDF)为基体，通过热压法和流延法分别制备 STTO/PVDF 复合材料，系统探索了制备工艺与材料组成对复合材料介电性能的协同调控作用。 热压法制备的材料 PVDF 以 α 相为主，而流延法则形成 α 与 β 两相共存结构。 随着 STTO 含量增加，两种材料均出现填料团聚与界面缺陷加剧的现象，但流延法制备的样品展现出更优的致密性。 在电学性能方面，流延法制备的复合材料具有更高的击穿场强(235.3~97.7 kV/mm)，而热压法则在介电性能方面表现更佳，可获得更高的介电常数(10.0~60.4)和更低的介电损耗(0.02~0.26)。 本研究明确了两种制备工艺的优势特征，热压法适用于高介电性能要求的应用场景，流延法则更适合高击穿场强需求的领域。
To meet the demand for high-performance flexible dielectric materials in microelectronics, giant-dielectric(Sm0.5Ta0.5)0.04Ti0.96O2 (STTO) ceramics were employed as fillers, and polyvinylidene fluoride (PVDF) was used as thepolymer matrix. STTO/PVDF composites with varying filler volume fractions were prepared via hot-pressing andtape-casting routes, with the aim of systematically investigating the synergistic effects of processing methods and materialcomposition on the microstructure and dielectric properties of the composites. The hot-pressed composites predominantlycontained α-phase PVDF, whereas the tape-cast samples contained both α- and β-phase crystals. With increasing STTOcontent, both types of composites display aggravated filler agglomeration and interfacial defects; however, the tape-castsamples demonstrate superior microstructural densification. The tape-cast composites achieve a relatively high breakdownstrength, ranging from 235.3 kV/mm to 97.7 kV/mm, whereas the hot-pressed composites exhibit superior dielectricperformance, with a higher dielectric constant (10.0~60.4) and lower dielectric loss (0.02~0.26). This work clarifies thedistinct advantages of these two processing routes: hot pressing is more suitable for applications requiring high permittivity,whereas tape casting is preferable for insulation-critical scenarios requiring high breakdown strength.