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低温 Sn-xBi-1Ag 焊料合金的凝固微观组织及性能研究
Solidification Microstructure and Properties of Low-temperatureSn-xBi-1Ag Solder Alloys
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- DOI:
- 作者:
- 胡晓娟 1，曾 广 1，廖洁丽 1，樊江昆 2
HU Xiaojuan1, ZENG Guang1, LIAO Jieli1, FAN Jiangkun2
- 作者单位:
- 1. 中南大学 材料科学与工程学院，湖南 长沙 410083；2. 西北工业大学 凝固技术全国重点实验室，陕西 西安 710072
1. School of Materials Science and Engineering, Central South University, Changsha 410083, China; 2. State Key Laboratoryof Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, China
- 关键词:
- Sn-xBi-1Ag 合金；凝固微观组织；热重分析；热膨胀系数；纳米硬度
Sn-xBi-1Ag alloy; solidification microstructure; thermogravimetric analysis; coefficient of thermal expansion;nanoindentation hardness
- 摘要:
- Sn-Bi-Ag 合金的凝固微观组织及其性能对焊点的可靠性有重要影响。 以 Sn-10Bi-1Ag 和 Sn-57Bi-1Ag(质量分数，%)为研究对象，探索了 Bi 元素及冷却速率对合金凝固微观组织及纳米硬度的影响规律，同时明确了两种合金热稳定性和热膨胀系数的差异，建立了合金微观组织与性能的关联性。 结果表明，两种合金的凝固微观组织均由 β-Sn相，Bi 相和 Ag3Sn 相组成，Bi 含量对 Sn-xBi-1Ag 合金微观组织和纳米硬度的影响远大于冷却速率的影响。 不同冷却速率下，Sn-10Bi-1Ag 合金的硬度相比于 Sn-57Bi-1Ag 合金的硬度分别提高了~32%(10 ℃/min)和 ~22%(40 ℃/min)。 这是由于 Sn-10Bi-1Ag 合金中细小而弥散 Bi 颗粒阻碍了 β-Sn 基体的局部塑性变形，具有明显的强化作用。 Sn-57Bi-1Ag 合金中 β-Sn/Bi 片层间距也会影响其力学性能。此外，Sn-57Bi-1Ag 合金的热稳定性高于 Sn-10Bi-1Ag 合金，然而其平均热膨胀系数更低。
The solidification microstructure and properties of Sn-Bi-Ag alloys significantly affect the reliability of solderjoints. This study investigates the effects of Bi content and cooling rate on the solidification microstructure andnanohardness of Sn-10Bi-1Ag and Sn-57Bi-1Ag (wt.% ) alloys and compares their thermal stability and coefficient ofthermal expansion, thereby establishing the microstructure-property relationships. The results show that both alloys consistof β-Sn, Bi, and Ag3Sn phases, with the Bi content exerting a greater influence on the microstructure and nanoindentationhardness than the cooling rate. Under two different cooling rates, the nanohardness hardness of the Sn-10Bi-1Ag alloyincreases by ~32% (10 ℃/min) and ~22% (40 ℃/min) compared with that of the Sn-57Bi-1Ag alloy. This enhancement inthe Sn-10Bi-1Ag alloy is attributed to the fine dispersion of Bi particles impeding local plastic deformation of the β-Snmatrix, providing significant reinforcement. Additionally, the mechanical properties of the Sn-57Bi-1Ag alloy are influencedby the β-Sn/Bi lamellar spacing. Furthermore, compared with the Sn-10Bi-1Ag alloy, the Sn-57Bi-1Ag alloy exhibitsgreater thermal stability but a lower average thermal expansion coefficient